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dc.contributor.authorSmith, John R.de
dc.contributor.authorWang, Xiao-Gangde
dc.date.accessioned2004-12-03T15:07:21Z-
dc.date.available2004-12-03T15:07:21Z-
dc.date.created2001de
dc.date.issued2001de
dc.identifier.urihttp://hdl.handle.net/2003/1477-
dc.identifier.urihttp://dx.doi.org/10.17877/DE290R-11264-
dc.format.extent661391 bytes-
dc.format.mimetypeapplication/pdf-
dc.language.isoende
dc.publisherThe American Physical Societyde
dc.relation.ispartofseriesPhysical Review Lettersde
dc.subject.ddc530de
dc.titleCopper/Diamond Adhesion and Hydrogen Terminationen
dc.typeTextde
dc.identifier.doi10.1103/PhysRevLett.87.186103de
dc.type.publicationtypearticlede
dcterms.accessRightsrestricted-
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