Authors: Peng, Ru-Wen
Wang, Mu
Yin, Xiao-Bo
Zhong, Sheng
Zhu, Jian-Ming
Title: Nanostructured Copper Filaments in Electrochemical Deposition
Language (ISO): en
URI: http://hdl.handle.net/2003/19480
http://dx.doi.org/10.17877/DE290R-2154
Issue Date: 2001
Publisher: The American Physical Society
Appears in Collections:Issue 17

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