Peng, Ru-WenWang, MuYin, Xiao-BoZhong, ShengZhu, Jian-Ming2004-12-272004-12-2720012001http://hdl.handle.net/2003/1948010.17877/DE290R-2154enThe American Physical SocietyPhysical Review Letters530Nanostructured Copper Filaments in Electrochemical Deposition10.1103/PhysRevLett.86.3827article (journal)