Artificial intelligence‐based module type package‐compatible smart sensors in the process industry

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dc.contributor.authorNeuendorf, Laura M.
dc.contributor.authorKhaydarov, Valentin
dc.contributor.authorSchlander, Christiane
dc.contributor.authorKock, Tobias
dc.contributor.authorFischer, Joshua
dc.contributor.authorUrbas, Leon
dc.contributor.authorKockmann, Norbert
dc.date.accessioned2024-11-18T13:23:33Z
dc.date.available2024-11-18T13:23:33Z
dc.date.issued2023-08-09
dc.description.abstractImage analysis presents a set of powerful methods to receive additional information about multiphase processes. It enables the development of advanced applications for process monitoring and optimization or, so-called, soft sensors. However, the integration of advanced smart sensor systems based on image analysis into the process control system presents a complex task. To address this challenge, a modular automation concept offers a standardized interface to integrate modules. This paper presents an integration profile as a service specification that allows a plug-and-measure integration of smart visual sensors into modular plants. To verify the concept, we applied it to three different use cases. At the end, we discuss open challenges in the integration of complex analysis systems with multidimensional data streams into modular plants.en
dc.identifier.urihttp://hdl.handle.net/2003/42761
dc.identifier.urihttp://dx.doi.org/10.17877/DE290R-24593
dc.language.isoen
dc.relation.ispartofseriesChemie - Ingenieur - Technik; 95(10)
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/
dc.subjectArtificial intelligenceen
dc.subjectComplex data streamsen
dc.subjectComputer visionen
dc.subjectImage processingen
dc.subjectModular automationen
dc.subjectModule type packageen
dc.subject.ddc660
dc.titleArtificial intelligence‐based module type package‐compatible smart sensors in the process industryen
dc.typeText
dc.type.publicationtypeResearchArticle
dcterms.accessRightsopen access
eldorado.secondarypublicationtrue
eldorado.secondarypublication.primarycitationNeuendorf, L.M., Khaydarov, V., Schlander, C., Kock, T., Fischer, J., Urbas, L. and Kockmann, N. (2023), Artificial Intelligence-based Module Type Package-compatible Smart Sensors in the Process Industry. Chemie Ingenieur Technik, 95: 1546-1554. https://doi.org/10.1002/cite.202300047en
eldorado.secondarypublication.primaryidentifierhttps://doi.org/10.1002/cite.202300047

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