A PCB Integrated Differential Rogowski Coil for Non-Intrusive Current Measurement Featuring High Bandwidth and dv/dt Immunity
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In the development of next-generation power modules
for electric vehicles, demands for high efficiency, reliability,
low cost, high power density and therefore small size are of major
importance. A promising approach is the embedding of power
semiconductor devices into a printed circuit board (PCB), as
investigated by the HI-LEVEL project.
This paper deals with the research, design and experimental
verification of a current sensor based on the principle
of a Rogowski coil, which is integrated into a PCB, so that
it can measure the device current of the embedded power
semiconductor devices. As switched-mode currents are to be
measured, the dynamics of the current sensor were of major
concern. Moreover, as large voltage gradients caused by the
semiconductor devices inject parasitic capacitive currents into
the coil, a differential measurement approach was selected for
cancelling out disturbances caused by capacitive coupling.
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Rogowski coil, HI-LEVEL, capacitive coupling, PCB, differential Rogowski coil, current sensor
