Authors: | Cai, Dengke |
Title: | Optical and mechanical aspects on polysiloxane based electrical-optical-circuits-board |
Language (ISO): | en |
Subject Headings: | Polysiloxane EOCB Waveguide Microsystem fabrication and production Packaging Quality and Reliability |
URI: | http://hdl.handle.net/2003/25231 http://dx.doi.org/10.17877/DE290R-8242 |
Issue Date: | 2008-04-24T09:38:34Z |
Appears in Collections: | Arbeitsgebiet Mikrostrukturtechnik |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
complete_diss.pdf | Stand April 2008 | 3.38 MB | Adobe PDF | View/Open |
Cai_ueberarbeitete_Fassung.pdf | DNB | 3.14 MB | Adobe PDF | View/Open |
Cai_ueberarbeitet03_09.pdf | Stand März 2009 | 3 MB | Adobe PDF | View/Open |
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