Autor(en): | Yang, K. Sapanathan, T. Raoelison, R. N. Buiron, N. Rachik, M. |
Titel: | Fully coupled semi-analytical model for an electromagnetic-mechanical-thermal problem of a ring expansion test |
Sprache (ISO): | en |
Zusammenfassung: | A fully coupled semi-analytical model is proposed for a ring expansion test. In this model, we consider the electromagnetic, mechanical and thermal effects. During the development, an ideal case of electromagnetic ring expansion test is modelled using both semi-analytical and finite element methods. The analytical model also includes the changes in electrical resistance, mutual inductance and self-inductance as a function of radius during the ring expansion. The development procedure is divided into four separate calculation parts. Each individual part is validated before making the independent validation of the semi-analytical method to obtain a model with high accuracy and a robust calculation speed. The final prediction using this model closely resemble with the coupled finite element predictions, and it can be further extended to exploit for an inverse identification problem. |
Schlagwörter: | electromagnetic pulse forming analytical modelling material characterization high strain rate multiphysics coupling |
URI: | http://hdl.handle.net/2003/36975 http://dx.doi.org/10.17877/DE290R-18974 |
Erscheinungsdatum: | 2018-05-14 |
Ist Teil von: | 8th International Conference on High Speed Forming |
Enthalten in den Sammlungen: | ICHSF 2018 |
Dateien zu dieser Ressource:
Datei | Beschreibung | Größe | Format | |
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ICHSF2018-Paper_Sapanathan.pdf | DNB | 837.25 kB | Adobe PDF | Öffnen/Anzeigen |
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