Authors: Kaiser, Tobias
Cordill, Megan J.
Kirchlechner, Christoph
Menzel, Andreas
Title: Electrical and mechanical behaviour of metal thin films with deformation-induced cracks predicted by computational homogenisation
Language (ISO): en
Abstract: Motivated by advances in flexible electronic technologies and by the endeavour to develop non-destructive testing methods, this article analyses the capability of computational multiscale formulations to predict the influence of microscale cracks on effective macroscopic electrical and mechanical material properties. To this end, thin metal films under mechanical load are experimentally analysed by using in-situ confocal laser scanning microscopy (CLSM) and in-situ four point probe resistance measurements. Image processing techniques are then used to generate representative volume elements from the laser intensity images. These discrete representations of the crack pattern at the microscale serve as the basis for the calculation of effective macroscopic electrical conductivity and mechanical stiffness tensors by means of computational homogenisation approaches. A comparison of simulation results with experimental electrical resistance measurements and a detailed study of fundamental numerical properties demonstrates the applicability of the proposed approach. In particular, the (numerical) errors that are induced by the representative volume element size and by the finite element discretisation are studied, and the influence of the filter that is used in the generation process of the representative volume element is analysed.
Subject Headings: Computational multiscale simulations
Computational homogenisation
Electrical resistance
Anisotropic conductivity
Heterogeneous microstructures
Subject Headings (RSWK): Zerstörungsfreie Werkstoffprüfung
Metallisches Glas
Dünne Schicht
Konfokale Mikroskopie
Widerstand <Elektrotechnik>
Issue Date: 2021-10-05
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Appears in Collections:Institut für Mechanik

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