Autor(en): | Kaiser, Tobias Menzel, Andreas |
Titel: | An electro-mechanically coupled computational multiscale formulation for electrical conductors |
Sprache (ISO): | en |
Zusammenfassung: | Motivated by experimental findings on deformation induced microcracks in thin metal films and by their influence on the effective macroscopic electrical conductivity, a computational multiscale formulation for electrical conductors is proposed in this contribution. In particular, averaging theorems for kinematic quantities and for their energetic duals are discussed, an extended version of the Hill–Mandel energy equivalence condition is proposed and suitable boundary conditions for the microscale problem are elaborated. The implementation of the proposed framework in a two-scale finite element environment is shown and representative boundary value problems are studied in two- and three-dimensional settings. |
Schlagwörter: | Flexible electronic devices Electro-mechanical coupling Conductors Anisotropic conductivity Heterogeneous microstructures Multiscale modelling Scale-bridging |
Schlagwörter (RSWK): | Transportables Gerät Elektrischer Leiter Mikrostruktur Mathematische Modellierung Mehrskalenanalyse Werkstoffprüfung Finite-Elemente-Methode |
URI: | http://hdl.handle.net/2003/40090 http://dx.doi.org/10.17877/DE290R-21967 |
Erscheinungsdatum: | 2020-12-16 |
Rechte (Link): | https://creativecommons.org/licenses/by/4.0/ |
Enthalten in den Sammlungen: | Institut für Mechanik |
Dateien zu dieser Ressource:
Datei | Beschreibung | Größe | Format | |
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Kaiser-Menzel2020_Article_AnElectro-mechanicallyCoupledC.pdf | 1.55 MB | Adobe PDF | Öffnen/Anzeigen |
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