Autor(en): Kaiser, Tobias
Menzel, Andreas
Titel: An electro-mechanically coupled computational multiscale formulation for electrical conductors
Sprache (ISO): en
Zusammenfassung: Motivated by experimental findings on deformation induced microcracks in thin metal films and by their influence on the effective macroscopic electrical conductivity, a computational multiscale formulation for electrical conductors is proposed in this contribution. In particular, averaging theorems for kinematic quantities and for their energetic duals are discussed, an extended version of the Hill–Mandel energy equivalence condition is proposed and suitable boundary conditions for the microscale problem are elaborated. The implementation of the proposed framework in a two-scale finite element environment is shown and representative boundary value problems are studied in two- and three-dimensional settings.
Schlagwörter: Flexible electronic devices
Electro-mechanical coupling
Conductors
Anisotropic conductivity
Heterogeneous microstructures
Multiscale modelling
Scale-bridging
Schlagwörter (RSWK): Transportables Gerät
Elektrischer Leiter
Mikrostruktur
Mathematische Modellierung
Mehrskalenanalyse
Werkstoffprüfung
Finite-Elemente-Methode
URI: http://hdl.handle.net/2003/40090
http://dx.doi.org/10.17877/DE290R-21967
Erscheinungsdatum: 2020-12-16
Rechte (Link): https://creativecommons.org/licenses/by/4.0/
Enthalten in den Sammlungen:Institut für Mechanik

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